产品

Packaging Capability

Wafer size MAX:8inch Scribe size MIN:60um
Packaging shape Maximum die size（die size x*y） um2
TO-251  
TO-252  
TO-262  
TO-263  
TO-220F  
TO-220  
TO-220N  
TO-3P  
Bonding wire Aluminum wire AI 3~20mil Gold and copper wire 25~75um

 

Appearance Volume production capacity (monthly) Planning capacity
TO-251    
TO-252    
TO-262    
TO-263    
TO-220F    
TO-220    
TO-220N    
TO-3P    
DIP-8    

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